Advanced Thermal Solutions maxiGRIP™ clipKIT™ Heat Sink Attachments feature a two-component system that quickly and securely mounts heat sinks to a range of hot running Ball Grid Array (BGA) components. These attachments use a minimal amount of space on a PCB, eliminate the need to drill holes, and allow the heat sink to be detached and reattached without damaging the component or PCB in the event the PCB needs to be reworked.
Features
OverallIdeal for general purpose and high-performance applicationsAvailable for straight fin, slant fin, cross-cut, and pin fin heat sinksProvides tight, secure heat sink attachment in shock and vibration environmentsSteady, even attachment force helps achieve maximum performance from high-performance, phase-changing thermal interface materials (TIMs)Allows the heat sink to be detached and reattached without damaging the component or PCB in the event the PCB needs to be reworkedComes standard with clean break, reworkable, Chomerics T-766 phase change materialAssemblies available for components that are low profile (1.5mm to 2.99mm) or standard height (3mm to 4.5mm)Frame and spring clips can be installed by hand or with a maxiGRIP Installation Tool for greater ease and efficiency
