Laird Direct-to-Air Tunnel (DAT) Series Thermoelectric Assemblies (TEAs) offer a reliable and compact performance by cooling objects through conduction. The heat is absorbed by a cold plate and dissipated through a high-density heat exchanger equipped with an air ducted shroud and a brand name fan. These DAT thermoelectric assemblies minimize the number of airflow paths required to operate. The thermoelectric modules of these DAT assemblies are custom designed to achieve a high Coefficient of Performance (COP) to minimize power consumption and generate heat pumping action. Applications include medical diagnostics, semiconductor fabrication, food and beverage cooling, and industrial instrumentation.
Features
Cooling objects through conduction technologyPrecise temperature controlCompact-designHigh Coefficient of Performance (COP)Reliable solid-state operationsDC operationRoHS compliant
Applications
Analytical instrumentationSemiconductor fabricationPhotonics laser systemsIndustrial instrumentationSemiconductor fabricationFood and beverage coolingMedical diagnostic chamber refrigeration